Staff Engineer, Process Development

Your Role

• To support Process Development Manager and implement process development job in development and Transfer projects, sustaining the required physical/electrical target in semiconductor chip at competitive yield and integrating overall process to meet the target.

MBO:

• To plan, develop and implement individual/group development plan to meet Technology Goal.

Technology Development & Transfer

• Acquire from our technology partner (internal/external) the knowledge necessary for the successful transfer or development of technology.
• Lead the development of new processes and products based on customers’ need.
• Coordinate available resources from the process engineering, product engineering, FA, and manufacturing group in troubleshooting, resolving issues, process improvement, and yield enhancement.
• Enhance the yield and reliability of the acquired technology and process.
• DOE design for technology optimization.
• Follow up the customer lots.
• Transfer developed process to Operation (internal/external) and support stabilization.

EHS & Quality

• To contribute towards the achievement of quality objectives by complying to the quality operating system and participating in continuous improvement activities (defect prevention, reduction of variation or prevention of waste).
• To contribute towards the achievement of the EHS objectives by complying to the EHS policy and participating in the implementation of EHS management system
• Any other assignment deems fit that shall be given to you from time to time.

Your Profile

• Qualification: bachelor’s degree or higher in Engineering / Science
• Experience: Preferably with minimum of 3 years of working experience in semiconductor device physics & process integration.

Skills/Competencies:

• Behavioral Competencies
• Excellent communication/presentation skills
• Good leadership and organizing abilities

Technical/ Functional Competencies

• Basic knowledge of semiconductor physics and device. (Transistor, Resistor, Capicitor)
• Experiences on 180nm to 110nm Aluminum - Based BEOL integration
• Experience and knowledge on MIM, MOM, ILD, IMD, Passivation, Borderless Via, Bond Pad, Circuit Under Pad.
• Experience on Cu BEOL (Preferred)
• Knowledge on Wire Bonding and Advanced Package (Preferred)
• Job view for GDS data and MEBES data
• Understanding on the procedure of the development and transfer
• Basic knowledge of reliability (EM, SM, TDDB, HCI, NBTI, HTOL)
• Computer literacy in Microsoft Excel, Word, PowerPoint and Outlook.