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R&D Principal Process Engineer

Salary undisclosed

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Key Job Duties and Responsibilities:

  1. Stay updated on trends in optical module packaging technology, propose innovative process concepts, and develop a technology roadmap that aligns with CTQ (Critical to Quality) requirements.
  2. Lead and coordinate package development activities with both internal and external teams, covering package design and review, process evaluation, sample build management, as well as cost and capacity assessments.
  3. Conduct qualifications for new packages and processes, oversee the introduction of equipment and materials, and prepare documentation including process flows, control plans (CP), design/process Failure Mode and Effects Analysis (D/PFMEA), and design guidelines.
  4. Monitor the progress of new process developments to ensure timely delivery of each phase.
  5. Direct package-level failure analyses and improvement initiatives, regularly review failure cases, and maintain the Lessons Learned database.
  6. Manage the release of new technologies and handle patent applications.
  7. Oversee the development of new process platforms and optimize the process development system.

Skills & Qualifications:

  1. Bachelor's or Master's degree in Materials, Mechanical, Optical Engineering, or a related field.
  2. Minimum of 5 years of experience in semiconductor packaging processes (such as Die Attach, Wire Bonding, Flip Chip, etc.), with additional experience in optics being advantageous.
  3. Strong communication skills in English.
  4. Excellent problem-solving, interpersonal, and analytical abilities.