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PDE Technology Integration Engineer

Salary undisclosed

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The Technology Integration Engineering (TIE) Engineer will work closely with cross-functional teams, including TPM, Material, Substrate, CEM, Package Design, DDQA, and PIE teams. This role entails responsibility for the integration of new technologies as well as the management of new Technology Development (TD) projects in alignment with the package technology roadmap’s requirements. The effectiveness of this role will be measured by the on-schedule delivery of new technology development projects that meet the roadmap’s criteria to enable NPI and achieve satisfactory outcomes. Additionally, the individual in this role will serve as the domain specialist on TD business processes and systems and drive continuous improvement.

Job Responsibilities:

  • Integrate package technology roadmaps for both internal and OSAT assembly sites.
  • Lead and manage technology development activities as a Project Manager, working together with multi-functional teams to define project scope, develop project timeline, secure resources, perform risk assessment, manage budget, and align quality acceptance criteria.
  • Integrate the project’s scope, timeline, resources, budget, risks, and quality as part of project management and develop a detailed level of the project’s activities and deliverables.
  • Facilitate readiness activities for all development builds, ensuring all materials & collaterals are ready (Wafers, DMs, IDMs, MAM flow, System, etc.)
  • Drive, track, handle builds & communicate status to keep project execution on track and meet the committed timeline.
  • Document project deliverables for each TD phase gate according to TD playbook documentation requirements.
  • Facilitate TD project review and Technology Gate Review (TGR)
  • Manage the TD Confluence Space as a TD project management and communication tool.
  • Define, develop, and continuously improve the TD business processes & systems.
  • Acting as a point of contact to TPM on package technology-related matters.

Requirements:

  • Bachelor's Degree in Engineering with 3+ years of experience in Semiconductor Backend Manufacturing, preferably in Project/Process Integration, Project/Program Management, Technology Development, or Process Engineering role.
  • Demonstrated track record in baseline performance improvement, project management, business process creation, and data interpretation skills.
  • Excels in leading teams in a global manufacturing network involving team members of various fields and cultures.
  • Excellent analytical skills and organizational competency.
  • With good oral and written English communication skills.
  • Proficiency in critical computer applications like Excel, Word, PowerPoint & statistical tools.
  • Proficiency in Teamcenter, Power BI, and Power Apps.