Package Development Engineering Core Engineering Module (PDE CEM) Engineer

As a Package Development Engineering (PDE) Core Engineering Module (CEM) Engineer you will be primarily responsible for developing and optimizing processes to meet the schedule of business cases. To work on new product introduction and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You need to perform DOE and handle the NPI runs for the recipe creation and verification to verify the process performance and collect the data to reports. You will also be required to identify, diagnose, and resolve assembly process related problems by applying problem solving skills.

Job Responsibilities:

• Execute smooth transfer of new products and packages from NPI to HVM site
• Work with cross functional team and sites to execute smooth products transfer
• Validate and document baseline the POR, TOR and BOM for the transferred products and packages
• Execution of the qualification of NPI packages build that proliferate from the pilot products and packages according to planned timeline
• Execution of NPI Customer samples and Engineering Samples build for new products and packages according to planned timeline
• Evaluate and Improve Assigned Assembly Processes, Materials, and/or Equipment
• Participate in process, tool and material optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction
• Maintain in-depth assembly process and packaging knowledge, included materials and equipment knowledge as packaging integration.
• Identify all process variables, and Optimize process and/or equipment variables
• Perform containment of process and equipment deviations, and lead root cause finding and implement corrective actions
• Develop Process of Record (POR), define process edges and center the process (CPK), Apply DOE (Design of Experiments) techniques for process characterization
• Develop Process Capability Roadmap and Evaluate Equipment and/or Material Technologies

Job Requirements:

• Masters or bachelor’s degree in an Engineering
• Experience in backend engineering process or assembly package technology development preferred
• At least 3 years experience in semiconductor industry and candidates with proven experience in recipe creation, wire bond, die attach, encapsulation, post-encapsulation, wafer are highly encouraged to apply.
• Excellent problem-solving skill, and good in data analysis, statistical analysis, data interpretation skills
• A good team player equips with excellent interpersonal and communication skills.
• Highly result driven individual, self-motivated and ability to multi-task and manage dynamic priorities