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Wire Bond Senior Process Engineer

  • Full Time, onsite
  • OSRAM Opto Semiconductors (Malaysia) Sdn Bhd
  • Bayan Lepas, Malaysia
Salary undisclosed

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Description

  • Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheetetc).
  • Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily.
  • Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur.
  • Work closely with cross functional team like equipment, PO & Quality team on any issues arise.
  • Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up.
  • Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations.

Requirement

  • Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
  • Preferred with min 3-5 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing.
  • Experience in the Wire Bond process is highly preferred.
  • 6 Sigma Methodology, Green/Black Belt is an advantage.
  • Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI.