Process Engineer (Diebond & Wirebond ) - Batu Berendam Melak
RM 5,000 - RM 5,999 / Per Mon
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JOB DESCRIPTION To carry out all wire bond/die bond failure analysis. To carry out the machine maintenance, in order to achieve the high machine efficiency. To hold a meeting with SMT to improve assembly yield. To work with product development engineers on new product in production. To carry out and coordinate all the yield improvement evaluation. To buy off all new die bond and wire bond equipment. To support new machine setup and buy-off before phase in to production. To generate SOP for production. To work out matter of screening of hold tag lot. To maintain process yield as per target. To work with production to prevent quality issue occur at line. To have CI project on those high defect issue. JOB REQUIREMENTS Bachelor Degree in Material/Manufacturing / Mechanical engineering or other academy with equivalents. Diebond or Wirebond process experience in an automotive setting will be advantage. 4 – 5 years experience in Manufacturing or process engineering position Work independent Strong problem solving skill. Good interpersonal skills and positive attitude. For Malaysians Only. Interested candidate please send me your updated resume with photo to tracylim at orgresources .com .my or contact our office at 06-3361851/1852. (Tracy Lim)
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