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Maintenance Engineer - Assembly (Diebond/DLC/Cu Tape)

Salary undisclosed

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Job Overview: The Diebond/DLC/ CuTape Maintenance Engineer is responsible for ensuring the optimal performance, reliability, and maintenance of die bonding equipment used in semiconductor manufacturing. This role involves troubleshooting, repairing, and performing preventive maintenance on diebond systems, as well as supporting continuous improvement initiatives to enhance equipment performance.

Key Responsibilities:

  • Equipment Maintenance:
    • Perform routine preventive and corrective maintenance on Diebond /DLC/Cu Tape equipment to ensure optimal performance and minimize downtime.
    • Troubleshoot and resolve equipment issues, including mechanical, electrical, and software problems.
    • Maintain accurate maintenance records and documentation.
  • Technical Support:
    • Provide technical support to production teams to resolve equipment-related issues and minimize disruptions.
    • Collaborate with engineering and production teams to implement equipment upgrades and modifications.
  • Process Improvement:
    • Analyze equipment performance data to identify areas for improvement.
    • Develop and implement process improvements and maintenance strategies to enhance equipment efficiency and reliability.
  • Safety and Compliance:
    • Adhere to safety protocols and ensure compliance with industry regulations and standards.
    • Conduct safety inspections and risk assessments to maintain a safe working environment.
  • Training and Development:
    • Train and mentor junior maintenance staff and production operators on equipment operation and maintenance procedures.
    • Stay updated with the latest advancements in Diebond/DLC/Cu Tape technology and maintenance practices.
  • Qualifications:

    • Education: Minimum of 3-5 years of working experience in Maintenance Engineering, Mechanical Engineering, Electrical Engineering or equivalent and preferably in the semiconductor industry.
    • Experience: Minimum of 3 years of experience in maintenance engineering, with a focus on Diebond/DLC/CU Tape or similar semiconductor manufacturing equipment.
    • Technical Skills:
      • Proficiency in the operation and maintenance of Diebond/DLC/Cu Tape equipment.
      • Strong understanding of mechanical, electrical, and software systems.
      • Experience with diagnostic tools and maintenance management software.
    • Soft Skills:
      • Strong problem-solving abilities and attention to detail.
      • Excellent communication skills and the ability to work collaboratively in a team environment.
      • Ability to manage multiple tasks and prioritize effectively.

    Preferred Qualifications:

    • Experience with specific Diebond systems such as ESEC , ASM, Capcon, Pyxis
    • Knowledge of semiconductor manufacturing processes and industry standards.
    • Certifications related to equipment maintenance or semiconductor manufacturing.