Lead Engineer, Quality
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**Job Description**
**Position Summary:**
Responsible for analyzing semiconductor component failures to determine root causes, enabling the implementation of appropriate corrective actions.
**Responsibilities:**
- Conduct failure analysis on semiconductor components using various techniques, including electrical, physical, and chemical analysis.
- Utilize tools such as Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), X-ray, and thermal imaging for failure characterization.
- Identify root causes of failures through systematic investigation and data analysis.
- Document findings and prepare detailed reports summarizing analysis results, methodologies used, and recommendations for design or process improvements.
- Collaborate with design, process, and supplier engineering teams to implement corrective actions to prevent failure recurrence.
- Provide technical support for customer inquiries related to product failures and reliability issues.
- Support supplier negotiations as necessary to recover costs related to poor quality.
- Participate in continuous improvement initiatives to enhance failure analysis processes and methodologies.
- Stay current with advancements in failure analysis techniques and semiconductor technology.
- Has the authority and responsibility to halt any process or product delivery in the event of non-conformance with customer expectations, safety, or environmental risks.
**Work Environment:**
- Standard office setting, noisy and busy manufacturing areas/labs, and clean-room environments.
- AE is a highly dynamic, technically challenging, and fast-paced manufacturing workplace.
**Qualifications:**
- **Required:**
- Strong knowledge of semiconductor device physics, internal structures, fabrication processes, and reliability testing.
- Good understanding of power device internal structure and fabrication processes.
- Ability to perform DC/AC characterization and standardize analysis techniques for power MOSFET and IGBT trench FS technologies.
- Experience working closely with foundry engineers to validate silicon electrical performance in external foundries.
- Knowledge of simulation techniques for validating structural changes.
- Proficiency in failure analysis tools and techniques including SEM, FIB, X-ray, and other analytical equipment.
- Excellent problem-solving and analytical skills using 8D methodology:
- Is-Is Not
- Fishbone diagram
- Brainstorming
- Affinity Diagrams
- 3x 5 Why
- Strong written, verbal, and communication skills, with the ability to present findings to both technical and non-technical audiences.
- Ability to work effectively in a team-oriented environment and collaborate with cross-functional teams.
- **Preferred:**
- Experience in FAB manufacturing processes and technologies.
- Expertise in quality tools and process/production control methods, including:
- FMEA
- MSA
- SPC
- DOE/Taguchi
- DMAIC
- Proficiency with Microsoft Office applications (Word, Excel, PowerPoint, etc.)
**Experience:**
- Experienced-level position; >15 years of experience in the semiconductor industry preferred.
- Experience in a fast-paced, high-mix, low-volume manufacturing environment.
- Experience in manufacturing quality and product quality management.
- Familiarity with Sampling Plans, Statistical techniques, and other quality tools.
- Understanding of ISO 9001 quality systems, copy exactly requirements, and auditing knowledge.
- Plus point those candidates from:
- Lision Technology
- STMicroelectronics
- Nexperia
- Renesas Electronics
- Infineon
**Education:**
- Bachelor’s degree in engineering or a technical field from an accredited institution.
- Advanced Degree in Engineering/Science preferred.
- Six Sigma Green Belt desired.
Job Type: Full-time
Pay: Up to RM12,000.00 per month
Benefits:
- Additional leave
- Maternity leave
- Opportunities for promotion
- Professional development
Schedule:
- Fixed shift
Supplemental Pay:
- Yearly bonus
Education:
- Bachelor's (Required)
Experience:
- semiconductors industry: 10 years (Required)