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Field Service Engineer

Salary undisclosed

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Requirements: - Electrical / Mechanical / Electromechanical Diploma in Engineering. - Minimum 6 years experience in Semiconductor Compression Molding Systems. - Experience in Micro-electronics Packaging Systems. - Physically fit enough to conduct heavy lifting load in appropriate lifting capacity. - Work safe oriented and prepared to work with hot surfaces. - Require answering a call-in timely manner. - Behave with integrity and resilience. - Willing to work overtime / in shifts when required. - Accept overseas assignments on short notice and stay for weeks. - ICT literacy for paperwork and reporting. Responsibilities: - Commission, setup and maintain Automated Compression Molding Systems in the context of semiconductor manufacturing. - Machine Commissioning and Decommissioning. - Be able to setup machine for targeted manufacturing output. - Calibration and Optimizing of output. - Machine troubleshooting and repairing. - Periodic overhaul for automated systems. - Machine remodeling and upgrading. - Spare parts replacement. - Software calibrations and update. - Hardware optimizing and upgrading. - Conduct Basic Machine Operation and Maintenance Training. - Communicate with clients and colleagues / Teamwork oriented. - Routine Technical Support and Production support to clients. - Submit regular Systems Reports to the Engineering Manager.