Engineer III - Process

POSITION SUMMARY:

The Process Engineer will oversee, develop, and optimize manufacturing processes. Leading special projects to improve production efficiency and quality.

As a Senior Process Engineer specializing in Wire Bonding and Die Bonding at AE, you will play a critical role in support the manufacture of complex hybrid microelectronics, focusing primarily on wire bonding and die bonding processes. This role involves defining standard work for the wire bonding and die bonding manufacturing work cell, planning and executing projects aimed at improving production metrics, and collaborating with various engineering functions and operations.

The position is hands-on, requiring proficiency in both automated and manual equipment, and aims to enhance the competency of operations and engineering staff.

RESPONSIBILITIES:

• Responsible for first pass yield improvement plan.
• Follow up on daily production issue, lead the team on increasing yield, improving product quality, reducing the manufacturing cost.
• Follow up on the customer quality feedback, prepare corrective action, and monitor the implementation.
• Create and maintain detailed documentation of processes, procedures, and specifications.
• Develop best practices, routines, and innovative solutions to improve production yield and product quality.
• Perform process simulations and troubleshooting.
• Work along with IE to establish LBC (Line Balancing Chart) and Operator BF (Balancing Factor).
• Perform production line capacity planning.
• Lead CIP (Continuous Improvement Project) team to drive better process efficiency and quality.
• Collaborate with multidisciplinary teams of engineers, technicians and other staff.
• Adhere to organizational requirements on quality management, health and safety, code of conduct, legal stipulations, environmental, 5S policies and general duty of care.
• Maintain confidentiality of all information related to the production processes and components, business and other technology including materials.
• Other duties as assigned.

WORK ENVIRONMENT:

• Location: Penang Science Park, Simpang Ampat.
• Works in a fast-paced engineering/manufacturing lab environment.
• Also works in a standard office environment and uses general office equipment (telephone, PC, copier, fax machine, etc.).
• Works under limited supervision.
• Overtime may be necessary in times of increased demand.

QUALIFICATIONS:

• Possess good knowledge in Wire Bond and Die Bonding Processes (Wedge wire bonding).
• Have good knowledge in SPC, FMEA, Lean manufacturing and Six Sigma principles.
• Proficient in using wire bonding and die bonding equipment and tools (e.g., K&S, ASM, and Die Attach Equipment).
• Have knowledge in Design Of Experiment (DOE) will be an added advantage.
• Ability to read schematics and blueprints.
• Posses strong statistical data analysis, analytical and problem-solving skills.
• Ability to manage multiple projects and handle moderately complex engineering assignments in a fast-paced environment.
• Self-motivated, possess initiative and ability to work independently.
• Team player with good communication and interpersonal skills.
• Ability to demonstrate independent judgment, responsibility, and professionalism in front of program teams.
• Ability to handle moderately complex engineering assignments.
• Ability to read schematics and blueprints.
• Ability to exercise good judgment to resolve problems.

EXPERIENCE:

Essential:

• Minimum 7 years of experience working in a manufacturing process engineering (wire bonding and die bonding) and new product introduction (NPI) environment.

Desirable:

• Familiar with ISO quality system.
• Familiar with the Semiconductor Assembly BE process.

EDUCATION:

• Bachelor’s Degree in Mechanical / Electrical Engineering or a related field, or equivalent education and/or experience.

OTHERS:

Applicants must be willing to work in Penang Science Park, Simpang Ampat.

WHY JOIN US?

As part of our total rewards philosophy, we believe in offering and maintaining competitive compensation and benefits programs for our employees to attract and retain a talented, highly engaged workforce.

Our compensation programs are focused on equitable, fair pay practices including market-based base pay, an annual pay-for-performance incentive plan, and etc.

In addition to our competitive compensation practices, we offer a strong benefits package in each of the countries in which we operate. In Malaysia., we offer a rich benefits package that includes:

• Medical - health care plan, dental, and vision.
• Short and long-term disability and life insurance.
• Executive Employee Health Screening package.
• Generous paid time off starting at 15 days and 19 public holidays.
• 98 days of paid maternity leave for Moms and 7 consecutive days of paid paternity leave for Dads.
• AE Child-Of-Employee Scholarship Program.
• Employee Referral Program.
• Career Growth and Learning Opportunity.