FOL Process Engineer

Primary Function: 1. Job function includes providing engineering support for all process sustaining related matters and new device in the FOL process to meet quality, yield, delivery and strive to reduce manufacturing cost Minimum Qualification: • Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent • Mastery of Microsoft Office Application • Good written and verbal presentation skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings • Good in critical thinking and systematic problem-solving skills e.g., DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT etc. • Familiarity with statistical analytical software (JMP/Minitab) is an added advantage. • Familiarity with FOL equipment is an advantage. • Minimum of 3-5 years experience in process engineering capacity. Principal Responsibilities: • Responsible for sustaining & improving the Die Pre/ Die Attach / Wire Bond Process • Overall knowledge on semiconductor manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production. • Monitor and maintain Assembly yield within KPI target. • Key involvement in improving the systems to bring down scrap rate due to process excursions. • Initiate process improvements through effective evaluations of yield data and manufacturing defects and make adjustments to process equipment accordingly. • Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target. • Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically. • Develop Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable. • Knowledgeable in SPC and Risk Management/FMEA