As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will play a pivotal role in the advancement of packaging technology. Your expertise will be instrumental in defining, developing, and optimizing processes, equipment, and materials within the MRDA (Metrology & Real-Time Defect Analysis) scope.

Key Responsibilities

Identify, select, and evaluate new processes, equipment, and technologies to support current and future MRDA requirements.

• Define, develop, and establish new processes and equipment designs aligned with the Process and Packaging Roadmap.

• Develop creative solutions for new process capabilities and future technology requirements.

• Collaborate with equipment suppliers to develop new capabilities.

• Actively participate in Package Development Engineering activities.

• Conduct equipment benchmarking to identify the best suppliers and platforms.

• Build decision matrices for equipment and material selection.

• Generate and set up ADC, improve recipes, and establish PMON, Sampling Plans, BKM, CIP Strategies, and performance indicators.

Installation and Qualification of New Equipment:

• Plan and submit capital requests to acquire new equipment.

• Build purchasing specifications (Doc2 documents).

• Establish new equipment qualification criteria and activities roadmaps with respective functional teams.

• Prepare documentation and conduct training for site representatives.

• Conduct data gathering for low volume production

• Establish feedback loops for continuous improvement after mass volume production.

Continuous Improvement and Collaboration:

• Maintain and regularly update the Tool on Records (TOR) with input from various assembly sites.

• Translate process and material characteristics into equipment design requirements.

• Continuously search for new equipment or suppliers that align with Process/Packaging needs.

• Collaborate with production groups on upgrades of existing production equipment through continuous improvement projects.

Job Requirements

• Bachelor's or master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.

• 4+ years of experience in Semiconductor Manufacturing with a proven track record in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.

• Ability to work across organizational boundaries and geographies.

• Strong collaboration skills to translate needs into actionable plans and deliverables.

• Demonstrated capability to complete and implement global initiatives.

• Organized, meticulous, and results-focused.

• Demonstrated ability to encourage teamwork and lead others effectively.

• Proficiency in process simulation techniques, data interpretation, and statistical analysis.

• Excellent analytical skills and organizational proficiency.

• Strong oral and written English communication skills.