Die Bond Technical Expert
Salary undisclosed
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About the role
The Diebond Technical Expert is responsible for driving the diebond strategy in Nexperia BE
What you will do
- To assure that Nexperia has the right capabilities, aligned with package R&D roadmap
- To continuously drive improvements in capability and throughput together with the sites.
- To create synergies between Nexperia’s BE sites and make sure best practices are shared across
- To define the appropriate tooling design rules for the diebond area
What you will need
- Degree holder in Engineering related disciplines. Preferably Mechanical, Mechatronic or Electrical engineering.
- At least five (5) years of related working experiences in semiconductor manufacturing environment
- Skillful on Die bond assembly processes. Experience with the main Diebond models in Semiconductor BE
- Familiar with Six-sigma techniques, FMEA, DOE and statistics.
- Statistical analysis & quality and problem-solving tools. E.g. DOE, SPC, FMEA, 8D and Minitab etc.
- Able to work in international work environment with ability to influence people through data.
- Requires travel to Nexperia factories, partners and exhibitions.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
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