Process Manager – Power Semiconductor Assembly

We are looking for a highly skilled Process Manager to join our dynamic team, who will lead efforts to optimize and enhance power semiconductor assembly processes. If you have a strong background in power semiconductor packaging and process management, this is an exciting opportunity to play a key role in shaping our technology and driving innovation.

Job Responsibilities:

• Lead Process Optimization: Manage and optimize power semiconductor assembly processes to ensure efficiency, quality, and high throughput.
• Process Design & Development: Oversee the design, development, and implementation of assembly processes for power semiconductor devices, including discrete components such as diodes, transistors, and power modules.
• Cross-Functional Collaboration: Work closely with R&D, engineering, quality, and manufacturing teams to ensure seamless integration of new processes and technologies.
• Power Handling Expertise: Ensure that the assembly processes can handle high power requirements while maintaining product performance, reliability, and safety.
• Process Troubleshooting: Lead the identification and resolution of issues related to power handling, assembly defects, or process inefficiencies.
• Continuous Improvement: Implement continuous improvement initiatives, utilizing methodologies such as Six Sigma, Lean, and Design of Experiments (DoE).
• Team Leadership: Manage and mentor a team of engineers, guiding them in the execution of process-related projects and optimizing their professional growth.
• Compliance and Quality Control: Ensure that all processes comply with industry standards, including safety regulations and quality assurance protocols.

Qualifications:

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• Experience:
• 5+ years of experience in process engineering, with a focus on power semiconductor assembly and packaging.
• Proven track record of handling power semiconductor devices in assembly processes, including discrete components.
• Expertise in managing high-power handling capabilities within semiconductor processes.
• Technical Skills:
• Strong understanding of power semiconductor assembly processes, including wire bonding, die attach, and encapsulation techniques.
• Experience with Discrete Semiconductor Components (e.g., diodes, transistors, power MOSFETs, etc.).
• Familiarity with process simulation, DOE, and statistical analysis tools (e.g., Minitab, MATLAB).
• Knowledge of reliability testing for power devices (thermal cycling, high voltage, etc.).
• Leadership: Experience in leading teams and driving cross-functional projects to successful completion.
• Communication: Strong verbal and written communication skills to collaborate effectively across teams and report to senior management.

Job Types: Full-time, Permanent

Pay: Up to RM14,000.00 per month

Benefits:

• Dental insurance
• Health insurance
• Opportunities for promotion
• Professional development

Schedule:

• Fixed shift
• Rotational shift

Supplemental Pay:

• 13th month salary
• Performance bonus
• Yearly bonus

Application Question(s):

• What is the maximum power rating or power handling capability that your semiconductor assembly processes can support, particularly for discrete components ?

Experience:

• power handling: 5 years (Preferred)
• high-power discrete components and their assembly processes: 5 years (Preferred)