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Wirebond Process Engineer, Senior

RM 5,000 - RM 9,500 / month

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Position level : Senior

* Candidate must have experience in FOL process & familiar with wire bond.

RESPONSIBILITIES:

  • Responsible for sustaining & improving the Wire Bond Process.
  • Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production.
  • Monitor and maintain Assembly yield within KPI target.
  • Key involvement in improving the systems to bring down scrap rate due to process excursions.
  • Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly.
  • Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target.
  • Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically.
  • Develop Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable.
  • Knowledgeable in SPC and Risk Management/FMEA

REQUIREMENTS:

  • Bachelor of Science/ Engineering preferably majoring in Electronics or Electrical.
  • Experience working in high mix and high volume manufacturing environment will be an added advantage.
  • Good knowledge of process problem solving analysis.
  • Good computer literacy and knowledgeable in SAS JMP, Minitab and SPC knowledge.
  • Must exhibit a strong sense of analytical skills with hands on working attitude on machine troubleshooting will be an added advantage.
  • Adaptable and flexible to rapid changes to the business needs of the company.
  • Experience in supervising and leading a team of process personnel.

Job Type: Permanent

Pay: RM5,000.00 - RM9,500.00 per month

Schedule:

  • Monday to Friday

Supplemental Pay:

  • 13th month salary

Education:

  • Bachelor's (Preferred)

Experience:

  • Process Engineering: 5 years (Preferred)
  • Wire bond process: 5 years (Preferred)