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Lead the Strategic Technical Direction and manage the Technology Center for Research & Development (R&D). Provide leadership in developing and implementing strategies for R&D, including modeling, simulation, and managing the R&D Pilot Line. Key Responsibilities: -Lead strategic initiatives to develop and commercialize innovative technologies and align with corporate roadmaps. -Establish and strengthen critical internal capabilities to drive value engineering, cost reduction, and problem-solving. -Ensure Carsem’s technology remains competitive by recommending and guiding Carsem Technology Center Programs. -Build and enhance the infrastructure needed to meet strategic development goals. -Manage patent processes for Carsem's M-site and S-site to protect intellectual property. -Interface with customers for new products, materials, and process development, focusing on speed, cost-effectiveness, and seamless manufacturing. -Oversee multiple product design teams to enable quick time-to-market at optimal costs. -Lead packaging solutions and provide in-depth customer presentations on technology. -Collaborate with design and production teams to assess and provide essential product design, assembly, and testing information. -Ensure the technical aspects of the company’s strategy align with its business goals. -Advise management on new developments that may impact profitability, schedules, costs, or -customer relationships. -Stay informed on new technologies that could improve operations and products and present recommendations. -Develop and enhance products for key market segments, driving growth into new markets. -Manage the R&D pilot line, ensuring efficiency and continuous improvement. -Any additional tasks assigned by management. Job Requirements: Education & Experience: -Bachelor’s Degree in Computer Science, Software Engineering, Electrical & Electronic Engineering, Physics, or equivalent. -Minimum of 10-15 years of experience in the semiconductor industry. Technical Knowledge & skills: -Expertise in Assembly and Testing processes. -Strong understanding of IC packaging and materials. -Proficient in Project Management, from new product introduction to mass production. -Knowledge of lean manufacturing and manufacturing operations. -Business planning and budget management skills. -Strong interpersonal skills, capable of building and maintaining positive relationships with peers, customers, and stakeholders. -Excellent project management and cross-functional leadership skills. -Assertive, proactive, and a team player.