Sr. Director, Assembly Process Innovation
Salary undisclosed
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Position Description
The Senior Director, Assembly Process Innovation leads a team of 100+ engineers and technicians to introduce new packaging and products into NXP’s four internal assembly & test factories. The teams reside in Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China. This is a 3rd-line management position (manager of managers of managers) reporting to the Senior Vice President of Package Innovation in the organization led by NXP’s Chief Technology Officer. The key stakeholders/interfaces of this role are the leadership teams of the four factories, the manufacturing and supplier quality teams, and the business-aligned and central teams in Package Innovation.
Position Objectives / Deliverables
The Senior Director, Assembly Process Innovation leads a team of 100+ engineers and technicians to introduce new packaging and products into NXP’s four internal assembly & test factories. The teams reside in Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China. This is a 3rd-line management position (manager of managers of managers) reporting to the Senior Vice President of Package Innovation in the organization led by NXP’s Chief Technology Officer. The key stakeholders/interfaces of this role are the leadership teams of the four factories, the manufacturing and supplier quality teams, and the business-aligned and central teams in Package Innovation.
Position Objectives / Deliverables
- Spearhead packaging technology and process technology development to support product roadmap requirements for NXP’s internal AT manufacturing facilities.
- Lead new technology and new product introductions with first pass qualification and safe launch success in a high-volume manufacturing environment.
- Cultivate intrapreneurship in the team for both legacy and advanced packaging innovations that are competitive to contribute to NXP’s product roadmap, growth, and cost structure.
- Forge collaborative partnerships both internally and externally for new capabilities and opportunities that help address NXP’s business, quality, efficiency, etc. goals.
- Travel up to 25% to maintain and build relationships at the four factories and with Europe- and US-based stakeholders.
- Strong organizational leadership skills. Strong execution focus along with the ability to inspire, engage, and motivate.
- Strong communication and stakeholder management and influencing skills.
- Ability to identify, drive, and balance organization performing and transforming objectives and initiatives.
- Good business acumen and packaging technical know-how.
- 10+ technical experience and expertise in packaging and assembly technology.
- 3+ years of leadership experience in leading a group of managers.