Epicareer Might not Working Properly
Learn More

Die Attach Development Engineer

Salary undisclosed

Checking job availability...

Original
Simplified
1. MEMS Sensor Product Design & Development: Lead the design and development of MEMS sensors packaging for a variety of applications, ensuring high performance, reliability, and cost-effectiveness. Work with NPI/BPD teams to innovate and improve packaging technology. 2. Die Attach Expertise: Provide technical expertise in die attachment processes for MEMS sensors, including bonding methods, materials selection, and process optimization with ESEC and ASM die bonders. 3. Product Integration: Collaborate with SMT (Surface Mount Technology) process, molding and wire bonding process integration into complete products/packaging, ensuring compatibility and optimal functionality meeting customer product reliability and specification. 4. Troubleshooting & Problem Solving: Offer troubleshooting support for design and manufacturing issues related to packaging. Act as a technical resource for identifying root causes of failures, yield issues, and performance concerns. 5. Manufacturing Support: Work with production teams to optimizing manufacturing processes, including die attach, packaging, testing, and calibration, ensuring high-quality standards are met. 6. Documentation & Reporting: Maintain detailed records of design specifications, testing results, and technical reports. Provide clear documentation to support design reviews, production releases, and regulatory compliance. • Training & Knowledge Sharing: Mentor and train junior engineers and technical staff. Share knowledge and expertise through presentations, training sessions, and internal seminars. 7. Continuous Improvement: Stay up-to-date with advancements in technologies and die attach processes. Proactively recommend and implement improvements to enhance product performance and manufacturing efficiency (cost, cycle time, yield & quality) 8. Collaboration: Collaborate with external partners, customers, and suppliers as necessary to enhance product development and resolve technical challenges