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FA Lab, Senior Engineer

Salary undisclosed

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Responsibilities Perform package and PCBA assembly test defect from production, qualification on semi-finished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for root-causing of defect/s. SME on key FA equipment, maintain the FA tracking and FA equipment log sheet. Develop the FA process and FA capability for new product and new technologies. Qualifications Bachelor Degree in Material Engineering, Chemical Engineering, Chemical Science Requirements Minimum of 5 years of experience in failure analysis, preferably in the electronics industry failure analysis lab environment. Focusing on Material analysis equipment. Skills set with hand-on in FA tools or methodology such as: -X-section - grinding/ polishing, inspection defect refers to IPC-A-610, void/standoff height measurement. -DnP - Inspection, mapping, failure mode classification. -SEM/EDX: sample preparation for SEM, IMC measurement -2D x-ray: Basic operating, Image analysis -3D x-ray & CT-Scan Analysis -Optical Microscopy: Basic operating & measurement software -PCB Solderability test, includes Test procedure/ Judge pass/fail criteria per IPC STD -Reporting Familiar with package and device analysis methodology Familiar with semiconductor and SMT assembly process and technology Excellent communication and teamwork skills to effectively convey technical findings. Familiarity with statistical analysis and