Staff Engineer II

Packaging Technology Development: • Lead the package design and development of advanced semiconductor technology solutions. • Drive innovation in packaging technologies to improve performance, thermal management, and reliability and ensure the design passes the qualification. • Evaluate and implement new materials, processes, and methodologies to enhance packaging capabilities. • Developed process and machine parameters to ensure support for new package technology. • Innovate with advanced packaging methods such as Flip-Chip packaging with clip-bond and wire bond. Focus more on clip bond technologies. • Research and select suitable materials for semiconductor packaging (e.g., substrates, bonding materials, die-attach materials, molding compounds). • Ensure the packaging design supports high-speed electrical signals, minimal power loss, and low signal degradation. • Perform experiments and conduct trials to validate packaging processes. • Conduct extensive testing and failure analysis to ensure packaging solutions are durable and reliable under various operational conditions (e.g., thermal cycling, humidity, mechanical stress). • Develop scalable and cost-effective packaging processes suitable for mass production, including assembly and test processes. Education Level and Field of Study: • Bachelor’s/Master’s/Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field. Working Experience: • 5 to 15 years of experience in semiconductor packaging development, with at least 3 to 5 years in a leadership role. Technical and Professional Knowledge: • Strong knowledge of packaging technologies, materials, and reliability assessment methods. • Experience working with OSATs and semiconductor manufacturing processes. • Proven track record of managing projects from R&D to high-volume production. • Familiarity with simulation tools (thermal, mechanical stress, etc.) is a plus. Certification/ Licensing Requirements: • Experience with advanced packaging technologies. • Knowledge of IC substrate design, underfill, and solder bump technology. • Understanding of JEDEC, IPC, and other industry standards for packaging • Experience working with OSAT vendors and semiconductor companies. • Knowledge of AI, IoT, or automotive semiconductor packaging trends. • Experience in high-volume production environments. Personality Characteristics: • Stay up to date with emerging trends and breakthroughs in semiconductor packaging. • Drive patent filing and technical publications to establish thought leadership in the industry. • Provide mentorship and technical guidance to engineering teams. • Leading or participating in a cross-functional team means balancing the need for direction with the ability to work cooperatively. • Each department or function has its priorities and challenges. Having empathy and understanding for others' perspectives will help in finding common ground.