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Jobs or company...

Al Wire Bonding Process Development Engineer

Salary undisclosed

Apply on

Indeed MY

Availability Status

This job is expected to be in high demand and may close soon. We’ll remove this job ad once it's closed.

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Job Summary:

Power module assembly process (Al Wire Bonding) Development.

  • Technical Leadership on process technology development.
  • Technical Leadership on responsible processes between PIDC and Manufacturing.
  • Establish process POR through set up, feasibility and characterization followed by package development procedure.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.


More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Requirements:

  • Experienced year : Min.10 years.
  • Experienced areas : Al wire bonding (Al wedge, Au/Cu ball bonding), design career or equipment engineering carrier is plus.
  • Experienced packages : Transfer molded power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes)
  • Nationality : Local preferred.
  • Education : BS or MS degree.
  • Skills : Fluent with English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
  • Personal characteristics : self-motivated, independent, open mind to communicate, willing to take risk and managing.

1. Al wire bonding process development and enabling technology for transfer molded power module.

A. Capable to understand power module design and proposal for improvement from Al wire bonding process.

B. Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.

C. Familiar with Al wire materials.

D. Capability to define KPIV from failures modes.

E. Capability to define KPOV and generate output by analyzing process capability.

F. Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).

G. Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc).

2. Technical Leadership on Al wire bonding process.

A. Capable to initiate new process and equipment working with technical leader and supplier.

B. Responsible for P.O spec generation and buy-off.

C. Capable to create COO for new process and equipment.

D. Capable for benchmarking on the new and better process/equipment which are not not exist in company.

E. Capability to create process technology roadmap, especially for Al wire bonding.

F. Capability to generate new design rule based on characterization, working with technical leader and designer.

G. Capable to understand customer requirements, application and EHS.

H. Capable to find systematic solution and improvement planning for process defects.

I. Supporting quality issue during production, effectively working with manufacturing team.

3. COE Line Equipment Maintenance and Management.

A. Capable for Al wire bonding equipment and tooling set-up (on-hand skills).

B. Responsible for tooling and jig design, working with designer and suppliers for new tooling/jig design.

C. Responsible for equipment/tooling/jig readiness on time.

D. Leading Al wire bonding technician/operators to do the right job.

F. Sharing process technical issue, result and improvement plan to technical leader.

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