Die Attach Maintenance Engineer
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This job is expected to be in high demand and may close soon. We’ll remove this job ad once it's closed.
Qualification:
. Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent
· Minimum 5 years working experience as maintenance engineer is required.
· Mastery of Microsoft Office Application
· Good written and verbal presentation skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
· Practical experience with equipment in die attach process.
· Familiar with SPC, FMEA, DOE, TPM, OCAP, Control Plan, Working Instruction and Preventive maintenance.
Job Description/ Responsibility:
· Develop and execute equipment engineering to improve yield, quality, productivity and cost.
· Upgrade machine to achieve next level machine capability.
· Workout contingency plan for single piece machine.
· Improve equipment efficiency through control process optimization, flexibility of package conversion, equipment reliability and performance to original level.
· To lead, coach a team of technical specialist, technician in their skills, knowledge development.
· Ability to solve complex problems by redefining, improving known techniques, technology within, across projects.
· To perform in-depth troubleshooting on semiconductor front of line equipment failures, to coordinate and ensure proper setup, operation, enhancement of preventive/predictive maintenance and method of troubleshooting lines.
· Solve process, technical issues which require innovative ideas and technical insight, solutions require technical leadership, planning and organizational skills.
Job Types: Full-time, Permanent
Pay: RM3,000.00 - RM5,690.31 per month
Schedule:
- Monday to Friday