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Product Development Engineering Manager (Process)

RM 15,000 - RM 15,000 / Per Mon

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A Leading Semiconductor Manufacturing MNC (Bayan Lepas, Penang)

Product Development Engineering Manager: The role leads a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization.

Required: Experience with and knowledge of Flip Chip PGA/BGA processes, APQP, Project Management, 8D, Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis, Advanced Packaging Backend Processes, Thermo-Compression Bonding, Underfill and Lid attach processes.

Job Type: Full-time

Pay: From RM15,000.00 per month

Schedule:

  • Day shift

Education:

  • Bachelor's (Preferred)

Experience:

  • Thermo-Compression Bonding, Underfill: 8 years (Preferred)
  • Lid attach processes: 8 years (Preferred)
  • knowledge of Flip Chip PGA/BGA processes: 8 years (Preferred)
  • APQP, Project Management, 8D, Process Control: 8 years (Preferred)
  • SPC, DOE, QC Tools, FMEA: 8 years (Preferred)
  • Problem Analysis, Advanced Packaging Backend Processes: 8 years (Preferred)

Language:

  • English (Preferred)
  • Mandarin (Preferred)