WIRE BOND DEVELOPMENT ENGINEER

KEY JOB DUTIES & RESPONSIBILITIES: • Responsible for sustaining & improving the Die Attach / Wire Bond Process / Flip-Chip, etc • Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production. • Monitor and maintain Assembly yield within KPI target. • Key involvement in improving the systems to bring down scrap rate due to process excursions. • Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly. • Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target. • Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically. • Develop Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable. • Knowledgeable in SPC and Risk Management/FMEA JOB REQUIREMENTS: • Bachelor of Science/ Engineering preferably majoring in Electronics or Electrical. • Experience working in high mix and high volume manufacturing environment will be an added advantage. • Good knowledge of process problem solving analysis. • Good computer literacy and knowledgeable in SAS JMP, Minitab and SPC knowledge. • Must exhibit a strong sense of analytical skills with hands on working attitude on machine troubleshooting will be an added advantage. • Adaptable and flexible to rapid changes to the business needs of the company. • Experience in supervising and leading a team of process personnel.