PROCESS ENGINEER WAFER PROCESS DEV

Authorities 1. Train and guide other engineers and production technicians/operators on existing and new production equipment. 2. Plan and hold meetings to ensure customer's requirements and expectation are met and properly introduced to production. 3. Coordination of the implementation of new tools, technology and chemistry to ensure continued business by expanding capacity and capability of production and process. Responsibilities 1. Oversee and manage as a Team Module Leader for all evaluation and qualification runs for wafer bumping process. 2. Monitor, implement controls and drive process improvements related to the technologies, product and materials, aligning outcomes with the company’s business objectives and vision. 3. Provide comprehensive technical reports, perform yield analysis, and interpret data using advanced statistical methods to enhance process reliability and efficiency. 4. New product introduction (NPI) 5. Project management 6. Research and development, design of experiment 7. Installation of mechanical and optical tools. 8. Laboratory organization and supervision; maintenance of cleanroom equipment. 9. Acts as a trainer and mentor to recruit and upskill local process engineers, addressing the knowledge gap in the ENIG field while contributing to the development of local talent. 10. Ensures a sustainable transfer of skills to the local workforce, thereby reducing long-term dependency on expatriates. Process and Technology Scope 1. Chemical metallization; electroplating and electroless plating 2. Processing and refining of silicon substrates. 3. Coating of silicon substrates with different kinds of resist. 4. Analytic work with external and internal labs such as cross section, focused ion beam and secondary electron microscopy (FIB/SEM).