Senior Process Engineer

Position level : Junior / Senior

* Candidate must have experience in Bumping/ Stencil process (for Wafer).

Responsibilities:

• Evaluating existing processes and procedures to identify areas that need optimization.
• Assessing the efficiency of technologies, instruments, and equipment.
• Building, setting up, and improving systems, procedures, and equipment.
• Working with the other engineers in the relevant process module on prototype development.
• Projecting timeframes of projects, as well as creating work schedules and setting deadlines for the engineers and technicians in your process module.
• Performing quality control and resolving design, process and other issues throughout the implementation stages.
• Collecting and interpreting analytical and performance data, as well as preparing progress reports.
• Ensuring compliance with industry standards and safety regulations.
• Keeping abreast of developments and innovation in the area of specialization.

Requirements:

• Bachelor's degree in engineering or a related field of specialization preferred.
• A minimum of 3 years' experience as a Process engineer in semiconductor environment.
• Candidates must have experience in Wafer Bump process.
• Proficiency in engineering and project management.
• Extensive knowledge of engineering processes, structural design, and system optimization.
• Great organizational and time management skills.
• Exceptional analytical, strategic thinking, and problem-solving abilities.
• Excellent collaboration and communication skills.
• Ability to apply safety standards and adhere to industry regulations.

Job Types: Full-time, Permanent

Pay: RM5,000.00 - RM8,000.00 per month

Schedule:

• Monday to Friday

Supplemental Pay:

• Performance bonus

Education:

• Bachelor's (Preferred)

Experience:

• process improvement: 3 years (Preferred)
• bumping or stencil process: 3 years (Preferred)