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Overview:
We are seeking a highly skilled and experienced Senior Engineer specializing in Wirebond Process for semiconductor manufacturing. The ideal candidate will have a strong background in wirebonding technologies, process optimization, and quality control in the semiconductor industry.
Qualifications:
1. Bachelor's degree in Electrical Engineering, Materials Science, or related field. Master's degree preferred.
2. Minimum of 5 years of experience in wirebond process development and optimization in semiconductor manufacturing.
3. Proficiency in wirebonding process, equipment, tools, and techniques.
4. Strong analytical and problem-solving skills with a focus on quality and reliability.
5. Experience with statistical analysis and DOE (Design of Experiments) for process optimization.
6. Excellent communication and leadership skills to effectively collaborate with cross-functional teams.
7. Knowledge of industry standards and best practices in wirebonding processes.
Responsibilities:
1. Develop and optimize wirebond processes for semiconductor devices to meet performance and reliability requirements.
2. Lead and manage wirebond process development projects from concept to production.
3. Collaborate with cross-functional teams to ensure successful integration of wirebond processes into semiconductor manufacturing.
4. Conduct failure analysis and implement corrective actions to improve wirebond quality and reliability.
5. Establish and maintain process documentation, specifications, and procedures for wirebond processes.
6. Train and mentor junior engineers and technicians on wirebond process techniques and best practices.
7. Stay current with industry trends and advancements in wirebonding technologies to drive continuous improvement.