Fresh Engineer (Wire Bond)
Salary undisclosed
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Fresh Engineer (Wire Bond)
- Posted on September 27, 2024
Requirements
- * Degree in Electrical Electronics Engineering
- * Basic technical knowledge in Electronic / Semiconductors
Job Responsibilities
- 1. Responsible for Wire bond process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
- 2. Meet manufacturability and yield requirements, and work in a cross- functional team to ensure the developed processes maintain high yield in a HVM environment, meet quality and reliability industry standards for applications in data/telecommunication systems.
- 3. Support Customer return analysis, corrective actions & FA report writing.
- 4. Conduct DOE for assembly processes optimization and data analysis to drive yield improvement.
- 5. Monitor SPC data and maintains process control.
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