Product Development Engineering Manager (Process)
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A Leading Semiconductor Manufacturing MNC (Bayan Lepas, Penang)
Product Development Engineering Manager: The role leads a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization.
Required: Experience with and knowledge of Flip Chip PGA/BGA processes, APQP, Project Management, 8D, Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis, Advanced Packaging Backend Processes, Thermo-Compression Bonding, Underfill and Lid attach processes.
Job Type: Full-time
Pay: From RM15,000.00 per month
Schedule:
- Day shift
Education:
- Bachelor's (Preferred)
Experience:
- Thermo-Compression Bonding, Underfill: 8 years (Preferred)
- Lid attach processes: 8 years (Preferred)
- knowledge of Flip Chip PGA/BGA processes: 8 years (Preferred)
- APQP, Project Management, 8D, Process Control: 8 years (Preferred)
- SPC, DOE, QC Tools, FMEA: 8 years (Preferred)
- Problem Analysis, Advanced Packaging Backend Processes: 8 years (Preferred)
Language:
- English (Preferred)
- Mandarin (Preferred)
