Frontend Process Development Senior Staff Engineer (Singulation/Laser)

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop (or transfer from Regensburg) Singulation/Dicing/laser/grinding/CMP processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new processes, from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD REgensburg for new processes and technologies, be the expert for Singulation/Dicing/laser/grinding/CMP technologies, have a detailled market overview. Work on Collaboration and Standardization.

• B.Sc, Ph.D B.Engineering, Chemistry, Material Science, Master study of chemistry or microsystems technology, Ph.D. advantage.
• At least 5 years of experience in Singulation/Dicing/laser/grinding/CMP.
• Microsoft Office, Project management skills, FMEA, Statistics, 8D, 6sigma, Corner Stone, Minitab, JMP.
• Strong Process technical knowledge and project managemment skills. Good interpersonal skills, responsible, accountable, initiative, & able handle stress.
• Preferrably several years working experience in an industrial environment like semiconductor industries, in the area of Dicing/laser/grinding/CMP preferred.
• Strong knowledge in usage of semiconductor materials.
• Strong communication skills and ability to work in a team, analytical thinking and creativity.
• Willingness to travel.
• Individual contributor for new process introduction/R&D.

What we look forWhat we look for

• B.Sc, Ph.D B.Engineering, Chemistry, Material Science, Master study of chemistry or microsystems technology, Ph.D. advantage.
• At least 5 years of experience in Singulation/Dicing/laser/grinding/CMP.
• Microsoft Office, Project management skills, FMEA, Statistics, 8D, 6sigma, Corner Stone, Minitab, JMP.
• Strong Process technical knowledge and project managemment skills. Good interpersonal skills, responsible, accountable, initiative, & able handle stress.
• Preferrably several years working experience in an industrial environment like semiconductor industries, in the area of Dicing/laser/grinding/CMP preferred.
• Strong knowledge in usage of semiconductor materials.
• Strong communication skills and ability to work in a team, analytical thinking and creativity.
• Willingness to travel.
• Individual contributor for new process introduction/R&D.

Please contact Please contact Nurul Ain Rosli for further information via for further information via [email protected] or or +6043053200 ..