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Process Engineer

Salary undisclosed

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  • Responsible for supporting New Package development of processes in automotive applications.
  • Responsible for quality, yield, cost and process improvement activities.
  • Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc.
  • Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
  • Take ownership to work closely with upper management to align scope and direction of key projects.

Qualification

  • Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
  • 1-2 years of work experience with semiconductor assembly background for automotive customers.
  • Experience in MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
  • Good technical knowledge and hands-on experience in semiconductor manufacturing processes, such as saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
  • Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.
  • Good SPC, Process Control and other relevant statistical & problem-solving skills

Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project management knowledge is an added advantage.

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